Samsung mass produces new multi-chip package

Samsung Electronics has begun mass producing the industry’s best-performing multi-chip package, which will be used in mid- to high-end smartphones scheduled to hit major markets later this month.

This is the industry’s first Low-Power Double Data Rate (LPDDR) Universal Flash Storage (UFS) Multi-Chip Package to be mass produced, the chip maker said. The multi-chip package combines LPDDR5 memory and UFS 3.1 NAND storage, which has the capacity and efficiency to make 5G functionality accessible to a wider range of smartphone users.

Based on the latest mobile DRAM and NAND interfaces, Samsung’s new multi-chip package is able to deliver fast speed and high storage capacity with low power. This combination enables more smartphone users to enjoy 5G applications that were previously only available on premium flagship models, such as advanced photography, graphics-intensive gaming and augmented reality.

These flagship-level capabilities are made possible with an improvement in DRAM performance that reaches 50 percent ― from 17 gigabytes per second to 25 gigabytes per second. A doubling of the speed and performance of the NAND flash ― from 1.5 gigabytes per second to 3 gigabytes per second ― also contributes to the enhanced capabilities over the previous smartphone memory solution, the LPDDR4X-based UFS 2.2 solution.

The new multi-chip package also maximizes space efficiency within a smartphone by integrating DRAM and NAND storage into a single compact package measuring 11.5 millimeters by 13 millimeters. This compactness allows for more space for other features.

The multi-chip package can be customized according to 5G smartphone models, from mid- to high-end segments, with a 6-gigabyte to 12-gigabyte DRAM capacity and a 128-gigabyte to 512-gigabyte storage option.

Samsung said that the latest solution has completed compatibility testing with a number of global smartphone manufacturers. Handsets with Samsung’s latest multi-chip package are expected to hit mainstream markets later this month.

“Samsung’s new LPDDR5 uMCP is built upon our rich legacy of memory advancements and packaging know-how, enabling consumers to enjoy uninterrupted streaming, gaming and mixed reality experiences, even in lower-tier devices,” Sohn Young-soo, vice president of the company’s memory product team was quoted as saying in the release. “As 5G-compatible devices become more mainstream, we anticipate that our latest multi-chip package innovation will accelerate the market transition to 5G and beyond.”

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