SK hynix develops 1znm DRAM with industry’s highest density
SK hynix has completed the development of 1znm 16-Gigabit Double Data Rate 4 (DDR4) DRAM, the 16 Gigabit is the industry’s highest density for a single chip that offers the largest total memory capacity per wafer among existing DRAMs.
The world’s second-largest memory chip maker will finish preparations for the mass production of the new product by the end of the year and begin shipment next year in a bid to respond better to rapidly changing demand from global customers.
The Korean company said the productivity of the new 1znm DRAM has been improved by about 27 percent, compared to the previous generation, 1ynm.
The new product does not require extreme ultraviolet lithography, which is very expensive, giving it cost competitiveness.
The new product also supports a data transfer rate of up to 3,200 megabits per second, which is the fastest data-processing speed in a DDR4 interface.
SK Group’s chip-making unit said it has significantly increased power efficiency of the new product, reducing power consumption by about 40 percent compared to modules of the same density made with 1ynm 8-Gigabit DRAM.
The company, in particular, applied a new substance that has not been used in the manufacturing process of the previous generation in a bid to maximize the capacitance of the new 1znm DRAM product.
Capacitance, a key element of DRAM operation, refers to the amount of electrical charge a capacitor can store.
The company has also applied a new design technique in developing the new product to increase operational stability.
“The 1znm DDR4 DRAM boasts the industry’s highest density, speed and power efficiency, making it the best product to meet the changing demands of customers seeking high-performance, high-density DRAM,” said Lee Jung-hoon who heads the 1Z TF of DRAM Development and Business. “SK hynix will start mass production and full-scale delivery next year to actively respond to market demand.”
The company added that it is planning to expand the 1znm technology process to a variety of applications, such as the next-generation mobile DRAM.